dr. Z. Yu

PhD student
Electronic Instrumentation (EI), Department of Microelectronics

PhD thesis (Apr 2012): Low-Power Receive-Electronics for a Miniature 3D Ultrasound Probe
Promotor: Michiel Pertijs, Gerard Meijer

Themes: Health and Wellbeing

Publications

A Compact 10-MHz RC Frequency Reference With a Versatile Temperature Compensation Scheme
Pan, Sining; An, Xiaomeng; Yu, Zheru; Jiang, Hui; Makinwa, Kofi A. A.;
IEEE Journal of Solid-State Circuits,
pp. 1-9, 2023. DOI: 10.1109/JSSC.2023.3322307
A 1024-Channel 268-nW/Pixel 36×36μm2/Channel Data-Compressive Neural Recording IC for High-Bandwidth Brain–Computer Interfaces
Jang, Moonhyung; Hays, Maddy; Yu, Wei-Han; Lee, Changuk; Caragiulo, Pietro; Ramkaj, Athanasios T.; Wang, Pingyu; Phillips, A. J.; Vitale, Nicholas; Tandon, Pulkit; Yan, Pumiao; Mak, Pui-In; Chae, Youngcheol; Chichilnisky, E. J.; Murmann, Boris; Muratore, Dante G.;
IEEE Journal of Solid-State Circuits,
December 2023. DOI: 10.1109/JSSC.2023.3344798
A 1024-Channel 268 nW/pixel 36x36 μm2/ch Data-Compressive Neural Recording IC for High-Bandwidth Brain-Computer Interfaces
MoonHyung Jang; Wei-Han Yu; Changuk Lee; Maddy Hays; Pingyu Wang; Nick Vitale; Pulkit Tandon; Pumiao Yan; Pui-In Mak; Youngcheol Chae; EJ Chichilnisky; Boris Murmann; Dante G Muratore;
In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
2023. DOI: 10.23919/VLSITechnologyandCir57934.2023.10185288
Compressive Sensing Based High-Resolution DoA Estimation by Beamspace Covariance Gradient Descent
Yu, Zhibin; Abdelkader, Ahmed; Wu, Xiaofeng; Lamoral Coines, Adrián; Haardt, Martin;
In 2023 IEEE 9th International Workshop on Computational Advances in Multi-Sensor Adaptive Processing (CAMSAP),
pp. 321-325, 12 2023. DOI: 10.1109/CAMSAP58249.2023.10403481
A Novel SAR Sidelobe Suppression Method Based on CNN
Yuan, Sen; Yu, Ze; Li, Chunsheng; Wang, Shusen;
IEEE Geoscience and Remote Sensing Letters,
Volume 18, Issue 1, pp. 132-136, 2021. DOI: 10.1109/LGRS.2020.2968336
Co-Reduction of Common Mode Noise and Loop Current of Three-Level Active Neutral Point Clamped Inverters
Wang, Jianing; Liu, Xiaohui; Peng, Qiang; Xun, Yuanwu; Yu, Shaolin; Jiang, Nan; Wang, Wenbo; Hou, Fengze;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 9, Issue 1, pp. 1088-1103, 2021. DOI: 10.1109/JESTPE.2020.3043018
Room temperature ppt-level NO2 gas sensor based on SnOx/SnS nanostructures with rich oxygen vacancies
Hongyu Tang; Chenshan Gao; Huiru Yang; Leandro Nicolas Sacco; Robert Sokolovskij; Hongze Zheng; Huaiyu Ye; Sten Vollebregt; Hongyu Yu; Xuejun Fan; Guoqi Zhang;
2D Materials,
2021. DOI: 10.1088/2053-1583/ac13c1
Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 367-380, 2020.
The Impact of Gate Recess on the H2 Detection Properties of Pt-AlGaN/GaN HEMT Sensors
Robert Sokolovskij; Jian Zhang; Hongze Zheng; Wenmao Li; Yang Jiang; Gaiying Yang; Hongyu Yu; Pasqualina M. Sarro; Guoqi Zhang;
IEEE Sensors,
Volume 20, Issue 16, pp. 8947-8955, 2020.
document
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs
Cai, M.; Liang, Y.; Yun, M.; Chen, X-Y.; Yan, H.; Yu, Z.; Yang, D.; GuoQi Zhang;
IEEE Access,
2019. DOI: 10.1109/ACCESS.2019.2900361
Oxygen-based digital etching of AlGaN/GaN structures with AlN as etch-stop layers
Wu, J.; Lei, S.; Cheng, W-C.; Sokolovskij, R.; Wang, Q.; Xia, G. M.; Yu, H.;
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films,
2019. DOI: 10.1116/1.5115427
Impact of high temperature H2 pre-treatment on Pt-AlGaN/GaN HEMT sensor for H2S detection
Jian Zhang; Robert Sokolovskij; Ganhui Chen; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Wenmao Li; GuoQi Zhang; Yu-Long Jiang; Hongyu Yu;
Sensors and Actuators, B: Chemical,
Volume 280, pp. 138-143, 2019. DOI: 10.1016/j.snb.2018.10.052
Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
Hongyu Tang; Yutao Li; Robert Sokolovskij; Leandro Sacco; Hongze Zheng; Huaiyu Ye; Hongyu Yu; Xuejun Fan; He Tian; Tian-Ling Ren; GuoQi Zhang;
ACS Applied Materials and Interfaces,
pp. 40850-40859, 2019. DOI: 10.1021/acsami.9b13773
Maximum Nesigma0 Based on the New Steering Strategy for Geo Sar
Yuan, Sen; Li, Chunsheng; Yu, Ze; Geng, Jiwen; Yu, Jindong;
In IGARSS 2019 - 2019 IEEE International Geoscience and Remote Sensing Symposium,
pp. 8633-8636, 2019. DOI: 10.1109/IGARSS.2019.8898730
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 84, pp. 140-148, 2018.
Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
Sensors and Actuators B: Chemical,
2018. DOI: 10.1016/j.snb.2018.08.015
Distributed TDOA-based indoor source localisation
Wangyang Yu; N.D. Gaubitch; R. Heusdens;
In 2018 IEEE Int. Conf. on Acoustics, Speech and Signal Processing (ICASSP),
Calgary (Canada), IEEE, pp. 6887-6891, April 2018. ISSN: 2379-190X. DOI: 10.1109/ICASSP.2018.8462262
document
Au-based and Au-free Ohmic Contacts to AlGaN/GaN Structures on Silicon or Sapphire Substrates
Wenmao Li; Jian Zhang; Robert Sokolovskij; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Jingyi Wu; Lingli Jiang; Hongyu Yu;
In 18th International Workshop on Junction Technology,
2018.
Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; GuoQi Zhang;
Materials,
Volume 10, Issue 10, pp. 1181, 2017.
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
J Fan; C Yu; C Qian; X Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 74, pp. 179-185, 2017.
Scouting Logic: A Novel Memristor-Based Logic Design for Resistive Computing
Xie, Lei; Du Nguyen, HA; Yu, Jintao; Kaichouhi, Ali; Taouil, Mottaqiallah; AlFailakawi, Mohammad; Hamdioui, Said;
In VLSI (ISVLSI), 2017 IEEE Computer Society Annual Symposium on,
IEEE, pp. 176--181, 2017.
document
Luminous flux modeling for high power LED automotive headlamp module
C Yu; J Fan; C Qian; X Fan; GuoQi Zhang;
In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
2017.
Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
In Proceedings of Eurosensors,
pp. 463, 2017.
A Prototype PZT Matrix Transducer with Low-Power Integrated Receive ASIC for 3D Transesophageal Echocardiography.
C. Chen; S. Raghunathan; Z. Yu; M. Shabanimotlag; Z. Chen; Z. Y. Chang; S. Blaak; C. Prins; J. Ponte; E. Noothout; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
Volume 63, Issue 1, pp. 47‒59, January 2016. DOI: 10.1109/tuffc.2015.2496580

Abstract: ...
This paper presents the design, fabrication, and experimental evaluation of a prototype lead zirconium titanate (PZT) matrix transducer with an integrated receive ASIC, as a proof of concept for a miniature three-dimensional (3-D) transesophageal echocardiography (TEE) probe. It consists of an array of 9 × 12 piezoelectric elements mounted on the ASIC via an integration scheme that involves direct electrical connections between a bond-pad array on the ASIC and the transducer elements. The ASIC addresses the critical challenge of reducing cable count, and includes front-end amplifiers with adjustable gains and microbeamformer circuits that locally process and combine echo signals received by the elements of each 3 × 3 subarray. Thus, an order-of-magnitude reduction in the number of receive channels is achieved. Dedicated circuit techniques are employed to meet the strict space and power constraints of TEE probes. The ASIC has been fabricated in a standard 0.18-μm CMOS process and consumes only 0.44 mW/channel. The prototype has been acoustically characterized in a water tank. The ASIC allows the array to be presteered across ±37° while achieving an overall dynamic range of 77 dB. Both the measured characteristics of the individual transducer elements and the performance of the ASIC are in good agreement with expectations, demonstrating the effectiveness of the proposed techniques.
Acoustic Characterisation of a PZT Matrix With Integrated Electronics for a 3D-TEE Probe
S. Raghunathan; C. Chen; M. Shabanimotlagh; Z. Chen; S. Blaak; Z. Yu; C. Prins; M. Pertijs; J. Bosch; N. de Jong; M. Verweij;
In Proc. IEEE International Ultrasonics Symposium (IUS),
October 2015. (abstract).
Low-power receive electronics for a miniature real-time 3D ultrasound probe
M. Pertijs; C. Chen; S. Raghunathan; Z. Yu; M. ShabaniMotlagh; Z. Chen; Z. Y. Chang; E. Noothout; S. Blaak; J. Ponte; C. Prins; H. Bosch; M. Verweij; N. de Jong;
In Proc. IEEE International Workshop on Advances in Sensors and Interfaces (IWASI),
IEEE, pp. 235‒238, June 2015. invited paper. DOI: 10.1109/iwasi.2015.7184963
Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
In Proceedings of the 15th International Conference on Electronic Packaging Technology,
pp. 1198-1201, 2014.
Front-end receiver electronics for a matrix transducer for 3-D transesophageal echocardiography
Z. Yu; S. Blaak; Z. Y. Chang; J. Yao; J. G. Bosch; C. Prins; C. T. Lancee; N. de Jong; M. A. P. Pertijs; G. C. M. Meijer;
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
Volume 59, Issue 7, pp. 1500‒1512, July 2012. DOI: 10.1109/tuffc.2012.2350

Abstract: ...
There is a clear clinical need for creating 3-D images of the heart. One promising technique is the use of transesophageal echocardiography (TEE). To enable 3-D TEE, we are developing a miniature ultrasound probe containing a matrix piezoelectric transducer with more than 2000 elements. Because a gastroscopic tube cannot accommodate the cables needed to connect all transducer elements directly to an imaging system, a major challenge is to locally reduce the number of channels, while maintaining a sufficient signal-to-noise ratio. This can be achieved by using front-end receiver electronics bonded to the transducers to provide appropriate signal conditioning in the tip of the probe. This paper presents the design of such electronics, realizing time-gain compensation (TGC) and micro-beamforming using simple, low-power circuits. Prototypes of TGC amplifiers and micro-beamforming cells have been fabricated in 0.35-μm CMOS technology. These prototype chips have been combined on a printed circuit board (PCB) to form an ultrasound-receiver system capable of reading and combining the signals of three transducer elements. Experimental results show that this design is a suitable candidate for 3-D TEE.
A 9-channel low-power receiver ASIC for 3D transesophageal echocardiography
Z. Yu; S. Blaak; C. Prins; Z. Y. Chang; C. T. Lancée; J. G. Bosch; N. de Jong; G. C. M. Meijer; M. A. P. Pertijs;
In Proc. IEEE International Ultrasonics Symposium (IUS),
IEEE, pp. 2063‒2066, October 2012. DOI: 10.1109/ultsym.2012.0516

Abstract: ...
This paper presents a 9-channel low-power receiver ASIC dedicated to a matrix piezoelectric ultrasound transducer for 3D Trans-Esophageal Echocardiography (TEE). It consists of 9 low-noise amplifiers (LNAs), 9 time-gain-compensation (TGC) amplifiers and a 9:1 micro-beamformer. A prototype ASIC has been implemented in 0.35 μm CMOS technology, with a core area of 0.98 mm × 1.7 mm. It is operated at a 3.3 V supply and consumes only 0.5 mW per channel. The measured channel-to-channel mismatch is within ±1 dB. Acoustic measurements proved the micro-beamforming function of the ASIC when processing real ultrasound signals from a 3 × 3 transducer array. These promising results show that this design, after layout optimization, is suitable to be scaled up to accommodate a full matrix transducer.
Low-power receive-electronics for a miniature 3D ultrasound probe.
Z. Yu;
PhD thesis, Delft University of Technology, 2012.
Low-Power Receive-Electronics for a Miniature 3D Ultrasound Probe
Zili Yu;
PhD thesis, Delft University of Technology, April 2012.
document
Ultrasound beamformer using pipeline-operated S/H delay stages and charge-mode summation
Z. Yu; M. A. P. Pertijs; G. C. M. Meijer;
Electronics Letters,
Volume 47, Issue 18, pp. 1011‒1012, September 2011. DOI: 10.1049/el.2011.1786

Abstract: ...
The proposed ultrasound beamformer is based on the delay-and-sum beamforming principle. The circuit consists of several programmable delay lines. Each delay line is constructed by pipeline-operated sample-and-hold (S/H) stages with digitally-assisted delay control, which ensure delay-independent gain and good timing accuracy. The summation is realised in the charge domain using the charge-averaging method, which consumes virtually no extra die area or power. A prototype beamformer has been fabricated in a 0.35 m CMOS process to interface nine transducer elements. Measurement results show that this circuit consumes much less power and chip area than the prior art, while maintaining good accuracy and flexibility.
Imaging the Heart with Ultrasound: Interface Electronics Design for 3D Transesophageal Echocardiography
Z. Yu;
In The Sense of Contact 13,
Sense of Contact 2009, pp. -, 2011.
Design of a Beamformer for an Ultrasonic Matrix Transducer for 3D Transesophageal Echocardiography
Z. Yu; S. Blaak; G. C. M. Meijer; M. A. P. Pertijs; C. T. Lancée; J. G. Bosch; C. Prins; N. de Jong;
In Annual Sensor Technology Workshop Sense of Contact,
The Netherlands, April 2010. (Best Poster Award).
A programmable analog delay line for Micro-beamforming in a transesophageal ultrasound probe
Z. Yu; M. A. P. Pertijs; G. C. M. Meijer;
In Proc. IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT),
IEEE, pp. 299‒301, November 2010. DOI: 10.1109/icsict.2010.5667749
Design of a low power time-gain-compensation amplifier for a 2D piezoelectric ultrasound transducer
J. Yao; Z. Yu; M. A. P. Pertijs; G. C. M. Meijer; C. T. Lancee; J. G. Bosch; N. de Jong;
In Proc. IEEE International Ultrasonics Symposium (IUS),
IEEE, pp. 841‒844, October 2010. DOI: 10.1109/ultsym.2010.5935775

Abstract: ...
In this paper, a programmable time-gain compensation amplifier dedicated to a 2D piezoelectric ultrasound transducer is presented. It uses an open-loop amplifier structure consisting of a voltage-to-current converter and a current-to-voltage converter. The circuit has been designed in a standard 0.35-μm CMOS process. Simulation and measurement results show that gains of 0dB, 12dB, 26dB and 40dB can be achieved for input signals centered at 6MHz with 80dB dynamic range (100μV to 1V). The measured gain errors at 6MHz are below 1dB for all gain settings. The amplifier consumes only 130μW when driving a 250fF load.
Design of a micro beamformer for a 2D piezoelectric ultrasound transducer
S. Blaak; Z. Yu; G.C.M. Meijer; C.T. Lancee; J.G. Bosch; N. de Jong;
In M Pappalardo (Ed.), Proceedings 2009 IEEE International Ultrasonics Symposium,
IEEE, pp. 1338-1341, 2009. NEO.
Project pieken in de delta, heart in three dimensions interface electronics, design progress report V
Z. Yu;
Delft University of Technology, , 2008.
Project pieken in de delta, heart in three dimensions interface electronics, design progress report III
Z. Yu;
Delft University of Technology, , 2008.
Project pieken in de delta, heart in three dimensions interface electronics, design progress report IV
Z. Yu;
Delft University of Technology, , 2008.
Project pieken in de delta, Heart in three dimensions interface electronics, design progress report 1
Z. Yu;
Delft University of Technology, , 2008.
Project pieken in de delta, heart in three dimensions interface electronics, design progress report III
Z. Yu;
Delft University of Technology, , 2008.
Design constraints of the interface electronics for an ultrasonic matrix transducer for 3D transesophageal echocardiography
Z. Yu; G.C.M. Meijer; C.A. Prins; N. de Jong; H. van den Bosch;
In s.n. (Ed.), Proceedings of sense of contact X,
Sense of Contact 2009, pp. 1-4, 2008.
A programmable time-gain-compensation (TGC) amplifier for medical ultrasonic echo signal processing
Z. Yu; G.C.M. Meijer;
In s.n. (Ed.), Proceedings of ICSICT,
ICSIST, pp. 1-4, 2008.
The interface electronics for an ultrasonic matrix transducer for 3D transephageal echocardiography
Z. Yu; G.C.M. Meijer;
In s.n. (Ed.), Proceedings of Electronics-ET 2008,
Electronics 2008, pp. 19-22, 2008.
A precision band-gap reference in CMOS technology
Z. Yu;
PhD thesis, Delft University of Technology, 2007.
band-gap reference (NP60751) measurement report
Z. Yu;
PhD thesis, Delft University of Technology, 2007.
A 2nd order sigma-delta ADC as an interface circuit for SOI accelerometers
Y. Yu; S. Butselaar; K.A.A. Makinwa;
In s.n. (Ed.), Proceedings of ProRISC 2005, 16th Annual Workshop on Circuits, Systems and Signal Processing,
Dutch Technology Foundation, pp. 316-319, 2005. Editor onbekend, JH/STW.
Outer $(J_1,J_2)$-lossless factorizations of linear discrete time-varying systems
X. Yu; J. Scherpen; A.J. van der Veen; P.M. Dewilde;
In Proc. CDC,
IEEE, pp. 2249-2254, December 1996.
document
Time-varying System Identification, J-lossless Factorization, and H$_\infty$ Control
Xiaode Yu;
PhD thesis, Delft Univ. of Technology, Delft, The Netherlands, May 1996.
document
A Class of Subspace Model Identification Algorithms to identify Periodically and Arbitrarily Time-Varying Systems
M. Verhaegen; X. Yu;
Automatica,
Volume 31, Issue 2, pp. 201-216, 1995.
Application of a Time-Varying Subspace Model Identification Scheme to the Identification of the Human Joint Dynamics
X. Yu; M. Verhaegen;
In Proc. European Control Conf.,
Groningen, The Netherlands, pp. 603-608, June 1993.

BibTeX support

Last updated: 26 Dec 2018

Zili Yu

Alumnus

Left in 2012